Photoresist Adhesion Promoter

DisChem’s photoresist adhesion promoter enhances the bonding strength between photoresists and substrates, ensuring optimal performance in lithographic processes. This product is essential for applications where precise patterning is required, such as semiconductor manufacturing, MEMS fabrication, and nanotechnology. By improving adhesion, the promoter reduces the risk of delamination or peeling during subsequent processing steps. DisChem’s adhesion promoters are formulated to work with a variety of substrates, delivering reliable, high-quality results in even the most challenging fabrication environments.