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IC substrates are the last stage of PCB production and have many parallels with semiconductor processing. Based on Flip Chip technology, manufacturing packaging of high-performance Integrated Circuits is widely employed in mobile devices like smart phones, tablet computers, personal computers, graphics workstations, servers, and IT equipment. IC Substrate PCB work as the connection between the IC chip(s) and PCB through a patterned network of conductors and has plated through holes.
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