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Date | 7/4/2024 9:18:46 AM |
Price | USD 15.00 |
Higher thermal conductivity More matching thermal expansion coefficient Stronger and lower resistance metal film The solderability of the substrate is good, and the use temperature is high Good insulation Low high frequency loss High-density assembly is possible It does not contain organic ingredients, is resistant to cosmic rays, has high reliability in aerospace and has a long service life The copper layer does not contain an oxide layer and can be used for a long time in a reducing atmosphere
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