|
Additional treatments such as immersion gold or electroless nickel immersion gold (ENIG) may be applied to the substrate to improve its solderability and ensure reliable electrical connections. The manufacturing processes involved in producing SD card substrates are intricate and precise, requiring advanced technologies and expertise to achieve the desired performance and reliability. By understanding these processes, we gain a deeper appreciation for the engineering marvels that enable the seamless functionality of SD cards, empowering us to store and access our digital data with confidence in today’s interconnected world.
|