Know About the FCBGA Packaging Substrate

FCBGA, or Flip-Chip Ball Grid Array, is a type of packaging substrate utilized in semiconductor devices. It's a variation of the traditional BGA (Ball Grid Array) packaging. FCBGA packaging substrate involves mounting the silicon die facedown (hence the term "flip-chip") onto the substrate. This configuration allows for direct electrical connections between the die and the substrate using solder bumps.