LED Heat Dissipation Substrate Market

LED Heat Dissipation Substrate Market Overview
Heat dissipation/insulation substrate, which is a direct bonded copper (DBC) and a direct bonded aluminum (DBA), are existed between power semiconductor device and heat sink. Heat is transferred from surface of the power semiconductor device to the heat sink.
This report provides a deep insight into the global LED Heat Dissipation Substrate market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, SWOT analysis, value chain analysis, etc.

LED Heat Dissipation Substrate Market Analysis
The global LED Heat Dissipation Substrate market size was estimated at USD 419 million in 2023 and is projected to reach USD 1190.23 million by 2032, exhibiting a CAGR of 12.30% during the forecast period.
North America LED Heat Dissipation Substrate market size was estimated at USD 133.41 million in 2023, at a CAGR of 10.54% during the forecast period of 2025 through 2032.

Key Company
• Henkel Adhesives
• Sanyo Semiconductor
• Nitto Shinko Corporation
• Chaoshun Electronic
• Larid Technology


Market Segmentation (by Type)
• PCB Substrate
• Metal Core PCB Substrate
• Ceramic Substrate

Market Segmentation (by Application)
• Architectural Light
• Horticulture Light
• Spot Light

Key Benefits of This Market Research
• Industry drivers, restraints, and opportunities covered in the study
• Neutral perspective on the market performance
• Recent industry trends and developments
• Competitive landscape & strategies of key players
• Potential & niche segments and regions exhibiting promising growth covered
• Historical, current, and projected market size, in terms of value